Bonded fin and folded fin air cooled heat
sinks tailored for power electronic semiconductors and assemblies.
High fin density heat sinks offer very low thermal resistance.
Single Fan, Double Fan and Triple Fan bonded fin heat sinks available with thermal resistance as low as .0175 C/W.
Custom Bonded Fin heat sinks are available enabling the engineer with the ability, to tailor their cooling requirements to a specific design.
Custom bonded fin copper heat sinks with up to 3X the cooling of aluminum heat sinks.
High performance Impingement Bonded Fin Heat Sinks with extremely low cost per watt.
Variety of plating options available including anodizing, chromating, RoHS compliant Alodine 5200 and Acculabs 628.
Item #
Length (in)
Width
Height
Thermal Performance
CH6600F
8
5
1.5
0.08
Available with ball bearing muffin XL fan. Ideal for IGBT and power MOSFET applications as well as diode and SCR bridges. Extremely low cost per watt. The impingement cooling allows modules to be mounted close together. This allows the IGBT’s to operate at the same temperature, increasing system reliability. This also allows for shorter bus bars, resulting in lower circuit inductance.
Available with ball bearing muffin XL fan. Ideal for IGBT and power MOSFET applications as well as diode and SCR bridges. Extremely low cost per watt. The impingement cooling allows modules to be mounted close together. This allows the IGBT’s to operate at the same temperature, increasing system reliability. This also allows for shorter bus bars, resulting in lower circuit inductance.
Integrate your design and put all of your power on one heat sink. If you are using more than one heat sink for different parts of your circuit, this could be the solution for you.
Highest watt per cubic inch over other designs. Modules can be mounted parallel to the fins to eliminate upstream heating effect. This allows IGBT’s to all operate at the same temperature to increase system reliability. Can be ordered complete with a high performance ball bearing fan installed or fan ready.
Integrate your design and put all of your power on one heat sink. If you are using more than one heat sink for different parts of your circuit, this could be the solution for you.
Highest watt per cubic inch over other designs. Modules can be mounted parallel to the fins to eliminate upstream heating effect. This allows IGBT’s to all operate at the same temperature to increase system reliability. Can be ordered complete with a high performance ball bearing fan installed or fan ready.
Integrate your design and put all of your power on one heat sink. If you are using more than one heat sink for different parts of your circuit, this could be the solution for you.
Highest watt per cubic inch over other designs. Modules can be mounted parallel to the fins to eliminate upstream heating effect. This allows IGBT’s to all operate at the same temperature to increase system reliability. Can be ordered complete with a high performance ball bearing fan installed or fan ready.
Ideal for use with large IGBT, Diode and SCR modules in high wattage applications. Exceptional low thermal resistance, as low as 0.024 °C/W, provides more effective cooling per cubic inch of space compared to extruded heat sinks. Can be ordered complete with a high performance ball bearing fan installed or fan ready.
Ideal for use with large IGBT, Diode and SCR modules in high wattage applications. Exceptional low thermal resistance, as low as 0.024 °C/W, provides more effective cooling per cubic inch of space compared to extruded heat sinks. Can be ordered complete with a high performance ball bearing fan installed or fan ready.
Ideal for use with large IGBT, Diode and SCR modules in high wattage applications. Exceptional low thermal resistance, as low as 0.024 °C/W, provides more effective cooling per cubic inch of space compared to extruded heat sinks. Can be ordered complete with a high performance ball bearing fan installed or fan ready.
Increased thermal performance over natural convection Engineered Heat Sinks. Ideal for applications where high thermal density semiconductors such as IGBT and Power MOSFET’s are used. Can be ordered complete with a high performance ball bearing fan installed or fan ready.
Increased thermal performance over natural convection Engineered Heat Sinks. Ideal for applications where high thermal density semiconductors such as IGBT and Power MOSFET’s are used. Can be ordered complete with a high performance ball bearing fan installed or fan ready.
Ideal for applications where forced air-cooling isn’t an option. Heat sink size can be reduced up to 50% over comparable extruded type heat sinks while maintaining the same semiconductor temperature. Custom designs available.
Ideal for applications where forced air-cooling isn’t an option. Heat sink size can be reduced up to 50% over comparable extruded type heat sinks while maintaining the same semiconductor temperature. Custom designs available.
Ideal for applications where forced air-cooling isn’t an option. Heat sink size can be reduced up to 50% over comparable extruded type heat sinks while maintaining the same semiconductor temperature. Custom designs available.
Ideal for applications where forced air-cooling isn’t an option. Heat sink size can be reduced up to 50% over comparable extruded type heat sinks while maintaining the same semiconductor temperature. Custom designs available.
